Project reference
27 defect categories assessed; 0.012 mm/pixel; CT 500 ms.
JINCE / APPLICATION VIEW

27 defect categories assessed; 0.012 mm/pixel; CT 500 ms.
Define the solder joints and structural regions to inspect, and whether dimensions support process monitoring or acceptance decisions.
Choose imaging angles and lighting for each target region, then configure appearance analysis and 2D measurements in the workflow.
Validate reflections, pose changes and false rejects using representative samples. Evaluate new inspection items separately.